Application for the HELSB Chilambana University Student Loan Application for Zambian Students—2024 Entry is now open at Chilambana University in Zambia.
Applications are invited from suitably qualified Zambian nationals that meet the minimum requirements outlined here below to apply for the undergraduate student loan for the 2024 academic year.
The Higher Education Loans and Scholarships Board (HELSB) was established with the additional mandate of sourcing funds, allocating, and disbursing student loans to Zambians pursuing higher education in recognised institutions of higher learning. It also has the mandate to recover all mature loans disbursed since 2004.
HELSB CHILAMBANA UNIVERSITY STUDENT LOAN ELIGIBILITY
Scholars are selected based on the following criteria:
- Be Zambian citizens with Green National Registration Cards (NRC)
- School leavers admitted to Chilambana University.
- School leavers who completed Grade 12 in 2021, 2022 and 2023
- 24 years old or younger by September 2024.
HELSB CHILAMBANA UNIVERSITY STUDENT LOAN APPLICATION INSTRUCTIONS
The application will only be complete if the following documents are submitted:
- Letter of application responding to the advertisement;
- A photocopy of the University admission letter;
- A photocopy of the Grade 12 statement of Results or Certificate;
- Photocopies of the applicant’s NRC, parent’s or guardian’s NRC, birth certificate, and 2 recent passport copies.
- An application form from the Higher Education Loans and Scholarships Board (HELSB). Rural students need not include this form but would be required to buy one at the time of registration.
Remember to include an active contact address, including an email address and phone number.
Applicants should submit their documents to the following address:
- The Chief Executive Officer
- Higher Education Loans and Scholarship Board
- P.O BOX 50464
- Longacres
- Lusaka, Zambia
OR kindly hand deliver to:
- Room 23 (Registry)
- Maxwell House, Annex Building
- Los Angeles Boulevard
- Lusaka, Zambia
Completed applications and attachments must be sent on or before the deadline date for applications: July 31, 2024.
